Table of Contents
Issues of Scale in Semiconductors
Growth of the Si industry
Semiconductors: Sutton’s Law of R&D
Some industry issues
Some scaling challenges are fiscal...
Scaling the transistor
Historical scaling
Scaling the interconnect
Voltage scaling
Reductions in power consumption
2001 ITRS: future scaling
The “SIA Roadblock” in CMOS
The materials in the Red Brick Wall
The New “New Materials Review Board”
CMOS beyond the Wall
The oxide: #1 technology challenge
“Doomsday” deferred
Ultimate limit to insulating layer
Nitride distributions in SiON
Beyond SiO2: High-k dielectrics innocent (until …)
The interface challenge
Doping control: TEM for point defect clusters
Doping control requires control of interfacial phases
Interconnect materials
Beyond core CMOS: integrated RF modules, SOC, SIP
Performance modules in CMOS core
The next generation: integrating the system
Materials challenges for CMOS beyond the wall
Beyond Silicon
Improvements in fibre capacity
Optical systems: Heterogeneous integration
Improved optical packing
Silicon MEMS in Optical Networking
Materials challenges for MEMS
Beyond CMOS, post-2002
Summary
Back-ups
Drivers for the Semiconductor Biz
The fibre-optic implosion
CMOS with Dual Gate Oxides
Measuring oxide thicknesses
Oxide reliability E to 1/E extrapolation
The next generation of waveguide devices?
III-V integration: state of the art
The light-emitting capacitor
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